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Maximum component density for a given PCB size can be obtained by
1. Leaded components and single sided PCB
2. Leaded components and double sided PCB
3. SMD components and double sided PCB
4. SMD components and multi layer PCB

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Correct Answer - Option 4 : SMD components and multi layer PCB

Explanation-

SMD components-

SMD components (Surface Mount Devices) are the electronic function parts, which are soldered to the circuit board by surface mount technology.The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and it limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards.

Whereas in Surface-mount technology  components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly onto the PCB surface, instead of wire leads to pass through holes. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much smaller PCB assemblies with much higher circuit densities.

Multilayer Sided PCB-

PCBs can be single-sided (one copper layer), double-sided (two copper layers on both sides of one substrate layer), or multi-layer (outer and inner layers of copper, alternating with layers of substrate). Multi-layer PCBs allow for much higher component density, because circuit traces on the inner layers would otherwise take up surface space between components.

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